特莱仕（上海）千思板制造有限公司是千思板国际设在亚太区的全资子公司，千思板国际有限公司是建筑材料领域追求创新的佼佼者。千思板公司凭借逾 55 年的全球经验和产品创新，成为国际公认的采用科学表面解决方案的高品质面板顶尖开发商。千思板包括两大产品系列： TopLabPLUS,TopLabVERTICAL,专门针对要求最严苛的功能性和科学性应用而打造，同时还将诸如高耐用性和持久耐脏污等基本要求与极具吸引力且永不过时的配色相结合，激发无限灵感。2015 年，千思板公司内部开发了新一代电子束固化 (EBC) 技术，赋予 TrespaTopLabPLUS 和 TopLabVERTICAL 独特的表面特性。电子束固化是一种快速非热固化方法，主要按可控速率利用高能量电子束固化特殊表面。最终形成的封闭表面极为光滑，易于清洗，且具有耐化学性。
Trespa China Co.Ltd is a wholly owned subsidiary of Trespa International in the asia-pacific region. Trespa International is a leading innovator in the field of architectural materials. Thanks to more than 55 years of global experience and product innovation, Trespa is recognised internationally as a premier developer of high-quality panels for scientific surface solutions. The two TopLab product lines, TopLabPLUS, TopLabVERTICAL, are developed specifically for the most demanding functional and scientific applications and combine basic requirements like high durability and long-lasting hygiene with an attractive and timeless palette of inspiring colours.  In 2015, Trespa developed the next generation of its Electron Beam Curing (EBC) technology in-house, which gives Trespa TopLabPLUS and TopLabVERTICAL its surface properties. Electron Beam Curing is a fast, non-thermal curing method which uses high-energy electrons at a controlled rate to cure special surfaces. The result is a closed surface with excellent smoothness, cleanability and chemical resistance.